Radio wave 3D imaging technology

Vayyar Imaging, an Israeli 3D imaging sensor manufacturer, has launched a new chip that integrates a large number of transceivers and advanced DSP, which can be used to produce high-precision millimeter wave (mmWave) 3D imaging contours. The company claims that this progress breaks through the existing limitations of today's 3D imaging sensor technology.

This advanced CMOS SoC integrates 72 transmitters and 72 receivers in a single chip, covering imaging and radar bands from 3 GHz to 81 GHz, and is further enhanced by Tensilica P5 DSP that integrates large-capacity internal memory. The company said it can execute complex imaging algorithms without using any external CPU.

Melamed said the company has worked closely with Cadence, Taiwan Semiconductor Manufacturing Company (TSMC) and ASE Semiconductor (ASE) to jointly develop this RF/analog/digital ASIC using TSMC’s 65-nanometer LP process.

"Radio wave imaging is a powerful technology, but it has been dormant for decades. Now, Vayyar's new sensor has finally released its potential." Melamed said: "This multi-channel radar SoC can support millimeter waves and ultra Wideband (UWB) operation, the chip can generate signals; transmit, receive, and digitize them; then use the on-chip DSP processor to process the received signals to obtain a spatial image of the environment."

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