5g is developed by the third generation partnership project (3GPP).
The benefits of 5g are reflected in its three application scenarios:
Enhanced mobile broadband, ultra reliable low delay and massive machine communication. In other words, 5g can bring users higher bandwidth rate, lower and more reliable delay and larger capacity of network connection.
So with the advent of 5g, which aspects of the demand for electromagnetic shielding materials, thermal conductive materials and electronic components will be improved?
1) Promote the demand for electromagnetic shielding and thermal conductive materials and devices rapidly
The transmission rate, frequency and signal strength of 5g smart phones have been significantly improved. From core chips to radio frequency devices, from body materials to internal structures, parts and components will usher in new changes, putting forward higher requirements for electromagnetic shielding and heat conduction. In the future, electromagnetic shielding and heat conduction products are expected to show a trend of diversification, process upgrading and single machine consumption increase, with broader success Long space. According to the third-party prediction, the global market scale of EMI / RFI shielding materials will reach 7.8 billion US dollars in 2021, and the interface thermal conductive materials will reach 1.1 billion US dollars in 2020. The market scale of graphite heat dissipation materials, which belongs to the emerging industry, has reached nearly 10 billion yuan in the field of consumer electronics. With the rapid development of downstream market in 5g era, the increase of single machine demand and the increase of terminal equipment will bring huge incremental demand for electromagnetic shielding and thermal conductive materials and devices. Therefore, we believe that after 2021, the market of electromagnetic shielding and thermal conductive materials is expected to achieve faster growth.
2) Electromagnetic shielding and heat conduction products are widely used in consumer electronics and communication equipment
The wide use of high-performance communication equipment, computers, smart phones, automobiles and other terminal products has led to the rapid expansion of electromagnetic shielding and heat conduction devices and related industrial applications, and the product application has been deepened. At the same time, the application of electromagnetic shielding and heat conduction devices in electronic products can greatly improve the product quality and product performance. The 5g era is gradually approaching. With the introduction of high frequency, the upgrading of hardware components and the multiplication of the number of networking equipment and antenna, the electromagnetic interference between equipment and equipment and within the equipment itself is ubiquitous, and the harm of electromagnetic interference and electromagnetic radiation to electronic equipment is increasingly serious. At the same time, with the updating and upgrading of electronic products, the power consumption of the equipment is increasing, and the calorific value is also rising rapidly. In the future, the bottleneck of high-frequency and high-power electronic products is the electromagnetic radiation and heat generated by them.
In order to solve this problem, more and more electromagnetic shielding and heat conduction devices will be added in the design of electronic products. Therefore, the role of electromagnetic shielding and heat dissipation materials and devices will become more and more important, and the demand will continue to grow in the future.